This topic explores whether rinsing an ostomy pouch with water after emptying it can extend the wear time of the pouch and wafer. The idea is that since intestinal output is acidic and might degrade the pouch material and adhesive, rinsing with water could help slow down this process and reduce odor.
Here are some insights and advice shared by users:
1. Brand-specific reactions to water:
- Hollister: Some users found that warm water softened or dissolved the barriers and rings quickly, so it's advised to limit water contact. However, another user rinses frequently and still enjoys a 7-day wear time.
- Convatec: Users with two-piece systems rinse with warm water, either every time or a few times a week, and still achieve a 7-day wear time. One user adds diluted mouthwash to clean the pouch tail.
- Coloplast Sensura Mio one-piece: A daily rinse with hot water, followed by using Brava Lubricating Deodorant and blow-drying, reportedly keeps the pouch intact.
2. Techniques for rinsing:
- Keep a water bottle with your ostomy supplies to rinse immediately after emptying.
- Pinch the pouch near the tail before adding water to keep it in the upper part and prevent leaks.
- In public restrooms, flush the toilet at the same time to mask any splashing sounds.
3. Alternatives to rinsing:
- Switching to a closed-end pouch: One user removes the closed pouch, seals it in a zip-lock bag, and applies a new one, experiencing less odor and achieving a 10-day wear time on the barrier.
4. Extras and accessories:
- Use Brava Lubricating Deodorant for odor control and lubrication after rinsing.
- Diluted mouthwash can be an affordable option for cleaning the pouch tail.
- A hair dryer on a low setting can help dry the pouch interior after rinsing.
- Carry marshmallows to eat a few when away from home, as they can slow output.
5. General consensus:
- Many users find rinsing beneficial for reducing odor and keeping the pouch cleaner.
- The impact on wear time seems to depend on the brand, so it's recommended to test with your own system and observe any effects on the wafer or ring integrity.
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