This topic is about choosing and using anti-fungal powders to manage skin rashes that can occur around an ostomy site, particularly under the wafer. These rashes can be similar to those caused by athlete's foot and are often exacerbated by moisture. Here are some helpful insights and advice shared by others who have faced similar challenges:

- The poster has an adhesive allergy and can only use Coloplast Sensura Mio wafers. They experience fungal rashes if the wafer is worn for more than 2½ to 3 days, especially due to moisture from showers, sweat, a belly-button opening, and a nearby skin fold. They have tried angling the wafer to avoid the navel but still struggle with moisture.

- They are curious about the safety and effectiveness of using an anti-fungal powder along with a barrier wipe or spray at every wafer change, as their skin becomes weepy and causes early wafer detachment.

Products that have been found effective by others:
1. Desenex / Desonex Antifungal Powder: Apply at each change and "crust" with a barrier wipe. It is often praised for preventing or clearing yeast rashes.
2. Nystatin Topical Powder USP (brands: NYSTOP, Nyamyc): Prescription only, but many say it clears yeast quickly and is gentle on the skin.
3. Clotrimazole Cream USP 1%: Prescribed by some doctors, though one person felt it worsened their rash. Note that clotrimazole is anti-fungal, not antibacterial.
4. Over-the-counter Neosporin is suggested when the rash is bacterial.
5. No-Sting Skin Prep (Smith & Nephew) is preferred by some after regular skin-prep seemed to trigger a rash.

Application techniques:
- "Crusting": Dust a light layer of anti-fungal powder, seal it with a barrier wipe or spray, and repeat if needed before applying the wafer.
- Many find it safe to use anti-fungal powder and barrier at every change. If concerned about overuse, one person suggested experimenting with plain cornstarch.
- Aim the wafer at a 45-degree angle to allow the tape-covered skin to "breathe" and reduce friction. This has helped many reduce rashes.
- Keep wear-time shorter (3 days or less) to limit moisture build-up under the wafer.

Equipment adjustments to reduce rash-causing friction or moisture:
- Consider switching manufacturers if the rash might be due to an adhesive allergy, as different brands have varying tapes and hydrocolloids.
- The Nu-Hope 2-inch-wide support belt is recommended because it avoids pressing on the wafer’s fabric tape. Removing or loosening belts for a few days often allows rashes to heal.
- Hollister two-piece systems are praised for easy pouch rotation. Tips include using tiny drops of machine oil in the snap-ring and wiping flange edges with water to make snapping and rotating easier.
- In hot climates or with non-fabric pouch backs that cause heat rash, placing a thin mini-pad on the pouch provides a soft, absorbent buffer without bulky cotton covers.

General do’s and don’ts:
- Avoid lotions or creams directly under the wafer, as they can compromise adhesion and trap moisture.
- Use Benadryl at night if an allergic component worsens the rash, as one user personally practices.
- Seek sewing or community groups to make custom cotton pouch covers if commercial ones add too much bulk.